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Rescale Joins Microsoft Cloud for Manufacturing to Help Organizations Embrace Industry 4.0

With automated high performance computing in the cloud for R&D, manufacturers can build resilient and agile supply chains while streamlining product development

Rescale, a leader in high performance computing built for the cloud, today announced that it has been certified as a Microsoft Cloud for Manufacturing partner.

Microsoft Cloud for Manufacturing has created a complete ecosystem of partners that offer cloud solutions specifically designed to help manufacturers innovate in their workforces, factories, supply chains, and product design. These end-to-end cloud solutions for Industry 4.0 include capabilities that securely connect people, assets, workflows, and business processes, empowering manufacturers to be more innovative and resilient.

Supercomputing for R&D, Automated


The Rescale management platform removes the complexity of running high performance computing (HPC) for research and development. By automating how organizations use the cloud to support their digital engineering needs, Rescale helps manufacturers accelerate their time to market, improve product quality, and reduce costs.

The Rescale platform simplifies all aspects of HPC for R&D, making it quick and easy for manufacturers to tap into the state-of-the-art computing power available on Microsoft Azure, including the H, F, and N VM series. This allows Rescale to offer its customers even more choice and flexibility when it comes to deploying HPC workloads in the cloud.

With Rescale’s integration with Microsoft, manufacturers can digitally empower engineering teams to operate safe and agile factories while unlocking new revenue efficiencies and opportunities. With automated multi-cloud HPC orchestration from Rescale, manufacturers can take advantage of IoT, AI, and mixed reality technologies to drive new innovations, helping build more resilient supply chains and improve end-to-end visibility.

“We are excited to partner with Microsoft and join Microsoft Cloud for Manufacturing,” says Ethan Rasa, vice president of global technology alliances at Rescale. “This collaboration will allow us to accelerate our growth and provide our customers with even more value. We believe that the combination of Rescale’s HPC platform and Microsoft Azure is the best way for manufacturers to accelerate their innovation and connect the digital thread for Industry 4.0.”

Rescale’s HPC platform is used by a wide range of manufacturers across industries, including aerospace, industrial, automotive, and electronics. The platform is used to run a variety of high performance computing workloads, such as:

  • Simulation: Manufacturers use HPC simulations to test new products and designs before they are built. This helps to reduce the risk of costly errors and delays.
  • Analysis: Manufacturers use HPC analysis to gain insights into their operations. This helps them to improve efficiency, quality, and profitability.
  • AI: Rescale integration with Azure provides the computing power needed to take advantage of AI to accelerate and improve digital engineering and design.

    “We are pleased to welcome Rescale to the Microsoft Cloud for Manufacturing ecosystem,” says Dominik Wee, corporate vice president of the manufacturing and mobility industry group at Microsoft. “Rescale’s HPC management platform is a valuable addition to our portfolio of solutions. This collaboration will help our customers accelerate their innovation and pioneer a new era in manufacturing.”

Learn More About How Rescale Can Help
Accelerate Your Manufacturing Modernization Efforts
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Author

  • Ethan Rasa

    Ethan Rasa is Rescale’s global vice president of technology alliances. Before joining Rescale, he held corporate business development roles at Shutterfly and Calypso Technology, where he was responsible for building and scaling successful partnerships, driving revenue growth, and increasing market share. He holds an engineering degree from the University of California, Davis and an MBA from The Wharton School of the University of Pennsylvania.

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